Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
Sábháilte in:
| Údar corparáideach: | |
|---|---|
| Rannpháirtithe: | , |
| Formáid: | Leictreonach Ríomhleabhar |
| Teanga: | Béarla |
| Foilsithe / Cruthaithe: |
Bradford, England :
Emerald Group Publishing,
c2006.
|
| Sraith: | Soldering & surface mount technology ;
v.18, no. 2 |
| Ábhair: | |
| Rochtain ar líne: | An electronic book accessible through the World Wide Web; click to view |
| Clibeanna: |
Níl clibeanna ann, Bí ar an gcéad duine le clib a chur leis an taifead seo!
|
Míreanna comhchosúla: Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
- Lead-free solder interconnect reliability
- Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
- Microwave and millimeter-wave electronic packaging /
- Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
- Portable consumer electronics packaging, materials, and reliability /
- Adhesion in microelectronics /