Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging

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Sonraí bibleagrafaíochta
Údar corparáideach: ebrary, Inc
Rannpháirtithe: Bailey, Christopher, Liu, Johan
Formáid: Leictreonach Ríomhleabhar
Teanga:Béarla
Foilsithe / Cruthaithe: Bradford, England : Emerald Group Publishing, c2006.
Sraith:Soldering & surface mount technology ; v.18, no. 2
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