Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
সংরক্ষণ করুন:
| সংস্থা লেখক: | |
|---|---|
| অন্যান্য লেখক: | , |
| বিন্যাস: | বৈদ্যুতিক বৈদ্যুতিন গ্রন্থ |
| ভাষা: | ইংরেজি |
| প্রকাশিত: |
Bradford, England :
Emerald Group Publishing,
c2006.
|
| মালা: | Soldering & surface mount technology ;
v.18, no. 2 |
| বিষয়গুলি: | |
| অনলাইন ব্যবহার করুন: | An electronic book accessible through the World Wide Web; click to view |
| ট্যাগগুলো: |
কোনো ট্যাগ নেই, প্রথমজন হিসাবে ট্যাগ করুন!
|
অনুরূপ উপাদানগুলি: Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
- Lead-free solder interconnect reliability
- Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
- Microwave and millimeter-wave electronic packaging /
- Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
- Portable consumer electronics packaging, materials, and reliability /
- Adhesion in microelectronics /