Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
Guardado en:
| Autor Corporativo: | |
|---|---|
| Otros Autores: | , |
| Formato: | Electrónico eBook |
| Lenguaje: | inglés |
| Publicado: |
Bradford, England :
Emerald Group Publishing,
c2006.
|
| Colección: | Soldering & surface mount technology ;
v.18, no. 2 |
| Materias: | |
| Acceso en línea: | An electronic book accessible through the World Wide Web; click to view |
| Etiquetas: |
Sin Etiquetas, Sea el primero en etiquetar este registro!
|
Ejemplares similares: Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
- Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
- Lead-free solder interconnect reliability
- Lead-free solder interconnect reliability
- Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
- Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
- Microwave and millimeter-wave electronic packaging /