Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
Zapisane w:
| Korporacja: | |
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| Kolejni autorzy: | , |
| Format: | Elektroniczne E-book |
| Język: | angielski |
| Wydane: |
Bradford, England :
Emerald Group Publishing,
c2006.
|
| Seria: | Soldering & surface mount technology ;
v.18, no. 2 |
| Hasła przedmiotowe: | |
| Dostęp online: | An electronic book accessible through the World Wide Web; click to view |
| Etykiety: |
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