Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /

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Bibliographic Details
Other Authors:	Wu, Andy (Editor)
Format:	Electronic eBook
Language:	English
Published:	Zurich, Switzerland : TTP, 2014.
Series:	Applied mechanics and materials ; Volume 509.
Subjects:	Electronic apparatus and appliances > Congresses. Electronic packaging > Congresses. Microelectronic packaging > Congresses. Manufacturing processes > Congresses. Electronic books.
Online Access:	An electronic book accessible through the World Wide Web; click to view
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