Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /

書誌詳細

その他の著者:	Wu, Andy (編集者)
フォーマット:	電子媒体 eBook
言語:	英語
出版事項:	Zurich, Switzerland : TTP, 2014.
シリーズ:	Applied mechanics and materials ; Volume 509.
主題:	Electronic apparatus and appliances > Congresses. Electronic packaging > Congresses. Microelectronic packaging > Congresses. Manufacturing processes > Congresses. Electronic books.
オンライン･アクセス:	An electronic book accessible through the World Wide Web; click to view
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