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Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /

Whakaatu ērā atu putanga (1)
I tiakina i:
Ētahi atu kaituhi: Wu, Andy (Editor)
Hōputu: Tāhiko īPukapuka
Reo:Ingarihi
I whakaputaina: Zurich, Switzerland : TTP, 2014.
Rangatū:Applied mechanics and materials ; Volume 509.
Ngā marau:
Electronic apparatus and appliances > Congresses.
Electronic packaging > Congresses.
Microelectronic packaging > Congresses.
Manufacturing processes > Congresses.
Electronic books.
Urunga tuihono:An electronic book accessible through the World Wide Web; click to view
Ngā Tūtohu: Tāpirihia he Tūtohu
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
Whakaahuatanga ōkiko:1 online resource (245 pages) : illustrations.
Rārangi puna kōrero:Includes bibliographical references and indexes.
ISBN:9783038263944 (e-book)
ISSN:1662-7482 ;
1662-7482

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