Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /
Պահպանված է:
| Այլ հեղինակներ: | |
|---|---|
| Ձևաչափ: | Էլեկտրոնային էլ․ գիրք |
| Լեզու: | անգլերեն |
| Հրապարակվել է: |
Zurich, Switzerland :
TTP,
2014.
|
| Շարք: | Applied mechanics and materials ;
Volume 509. |
| Խորագրեր: | |
| Առցանց հասանելիություն: | An electronic book accessible through the World Wide Web; click to view |
| Ցուցիչներ: |
Չկան պիտակներ, Եղեք առաջինը, ով նշում է այս գրառումը!
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Նմանատիպ նյութեր: Components, packaging and manufacturing technology II :
- Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /
- Microwave and millimeter-wave electronic packaging /
- Microwave and millimeter-wave electronic packaging /
- ISTFA 2012 conference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA.
- ISTFA 2012 conference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA.
- Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /