Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging

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Bibliographic Details
Corporate Author:	ebrary, Inc
Other Authors:	Bailey, Christopher, Liu, Johan
Format:	Electronic eBook
Language:	English
Published:	Bradford, England : Emerald Group Publishing, c2006.
Series:	Soldering & surface mount technology ; v.18, no. 2
Subjects:	Manufacturing processes. Electronic packaging. Electronic books.
Online Access:	An electronic book accessible through the World Wide Web; click to view
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