Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
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| Autor kompanije: | |
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| Daljnji autori: | , |
| Format: | Elektronički e-knjiga |
| Jezik: | engleski |
| Izdano: |
Bradford, England :
Emerald Group Publishing,
c2006.
|
| Serija: | Soldering & surface mount technology ;
v.18, no. 2 |
| Teme: | |
| Online pristup: | An electronic book accessible through the World Wide Web; click to view |
| Oznake: |
Bez oznaka, Budi prvi tko označuje ovaj zapis!
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| Opis fizičkog objekta: | 72 p. |
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