Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.

Kaydedildi:

Detaylı Bibliyografya
Kurumsal yazarlar:	National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging, ebrary, Inc
Materyal Türü:	Elektronik Ekitap
Dil:	İngilizce
Baskı/Yayın Bilgisi:	Washington, D.C. : Alexandria, VA : National Academy Press ; Available from Defense Technical Information Center, Cameron Station, 1990.
Konular:	Electronic packaging > Materials. Electrical engineering > Materials. Electronic books.
Online Erişim:	An electronic book accessible through the World Wide Web; click to view
Etiketler:	Etiketle Etiket eklenmemiş, İlk siz ekleyin!

Internet