National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging & ebrary, Inc. (1990). Materials for high-density electronic packaging and interconnection: Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council. National Academy Press ; Available from Defense Technical Information Center, Cameron Station.
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Chicago-čujuhus (17. p.)
National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging juo Inc ebrary. Materials for High-density Electronic Packaging and Interconnection: Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council. Washington, D.C. : Alexandria, VA: National Academy Press ; Available from Defense Technical Information Center, Cameron Station, 1990.
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MLA-čujuhus (9. p.)
National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging juo Inc ebrary. Materials for High-density Electronic Packaging and Interconnection: Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council. National Academy Press ; Available from Defense Technical Information Center, Cameron Station, 1990.
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