Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--

Bibliografische gegevens

Hoofdauteur:	Liu, S. (Sheng), 1963-
Coauteur:	ebrary, Inc
Andere auteurs:	Liu, Yong, 1962-
Formaat:	Elektronisch E-boek
Taal:	Engels
Gepubliceerd in:	Hoboken, N.J. : Wiley, 2011.
Onderwerpen:	Microelectronic packaging > Simulation methods. Electronic books.
Online toegang:	An electronic book accessible through the World Wide Web; click to view
Tags:	Voeg label toe Geen labels, Wees de eerste die dit record labelt!