Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
Kaydedildi:
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| Materyal Türü: | Elektronik Ekitap |
| Dil: | İngilizce |
| Baskı/Yayın Bilgisi: |
Hoboken, N.J. :
Wiley,
2011.
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| Online Erişim: | An electronic book accessible through the World Wide Web; click to view |
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