Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /

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Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--

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Bibliographic Details
Main Author:	Liu, S. (Sheng), 1963-
Corporate Author:	ebrary, Inc
Other Authors:	Liu, Yong, 1962-
Format:	Electronic eBook
Language:	English
Published:	Hoboken, N.J. : Wiley, 2011.
Subjects:	Microelectronic packaging > Simulation methods. Electronic books.
Online Access:	An electronic book accessible through the World Wide Web; click to view
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Description
Summary:	"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
Physical Description:	xxii, 564 p. : ill.
Bibliography:	Includes bibliographical references and index.