Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /

Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--

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Bibliographic Details
Main Author: Liu, S. (Sheng), 1963-
Corporate Author: ebrary, Inc
Other Authors: Liu, Yong, 1962-
Format: Electronic eBook
Language:English
Published: Hoboken, N.J. : Wiley, 2011.
Subjects:
Microelectronic packaging > Simulation methods.
Electronic books.
Online Access:An electronic book accessible through the World Wide Web; click to view
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010 |z  2011019534 
020 |z 9780470827802 (hardback) 
020 |z 9780470827826 (oBook) 
020 |z 9780470828410 (ePub) 
020 |z 9781118082829 (Mobi) 
020 |z 9780470827819 (e-book) 
035 |a (CaPaEBR)ebr10494525 
035 |a (OCoLC)756280855 
040 |a CaPaEBR  |c CaPaEBR 
050 1 4 |a TK7870.15  |b .L58 2011eb 
082 0 4 |a 621.381/046  |2 23 
100 1 |a Liu, S.  |q (Sheng),  |d 1963- 
245 1 0 |a Modeling and simulation for microelectronic packaging assembly  |h [electronic resource] :  |b manufacturing, reliability and testing /  |c Sheng Liu, Yong Liu. 
260 |a Hoboken, N.J. :  |b Wiley,  |c 2011. 
300 |a xxii, 564 p. :  |b ill. 
504 |a Includes bibliographical references and index. 
505 0 |a pt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging. 
520 |a "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--  |c Provided by publisher. 
533 |a Electronic reproduction.  |b Palo Alto, Calif. :  |c ebrary,  |d 2011.  |n Available via World Wide Web.  |n Access may be limited to ebrary affiliated libraries. 
650 0 |a Microelectronic packaging  |x Simulation methods. 
655 7 |a Electronic books.  |2 local 
700 1 |a Liu, Yong,  |d 1962- 
710 2 |a ebrary, Inc. 
856 4 0 |u http://site.ebrary.com/lib/daystar/Doc?id=10494525  |z An electronic book accessible through the World Wide Web; click to view 
908 |a 170314 
942 0 0 |c EB 
999 |c 128021  |d 128021 

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