Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
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| Main Author: | |
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| Corporate Author: | |
| Other Authors: | |
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Hoboken, N.J. :
Wiley,
2011.
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| Subjects: | |
| Online Access: | An electronic book accessible through the World Wide Web; click to view |
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| 020 | |z 9780470827802 (hardback) | ||
| 020 | |z 9780470827826 (oBook) | ||
| 020 | |z 9780470828410 (ePub) | ||
| 020 | |z 9781118082829 (Mobi) | ||
| 020 | |z 9780470827819 (e-book) | ||
| 035 | |a (CaPaEBR)ebr10494525 | ||
| 035 | |a (OCoLC)756280855 | ||
| 040 | |a CaPaEBR |c CaPaEBR | ||
| 050 | 1 | 4 | |a TK7870.15 |b .L58 2011eb |
| 082 | 0 | 4 | |a 621.381/046 |2 23 |
| 100 | 1 | |a Liu, S. |q (Sheng), |d 1963- | |
| 245 | 1 | 0 | |a Modeling and simulation for microelectronic packaging assembly |h [electronic resource] : |b manufacturing, reliability and testing / |c Sheng Liu, Yong Liu. |
| 260 | |a Hoboken, N.J. : |b Wiley, |c 2011. | ||
| 300 | |a xxii, 564 p. : |b ill. | ||
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | |a pt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging. | |
| 520 | |a "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- |c Provided by publisher. | ||
| 533 | |a Electronic reproduction. |b Palo Alto, Calif. : |c ebrary, |d 2011. |n Available via World Wide Web. |n Access may be limited to ebrary affiliated libraries. | ||
| 650 | 0 | |a Microelectronic packaging |x Simulation methods. | |
| 655 | 7 | |a Electronic books. |2 local | |
| 700 | 1 | |a Liu, Yong, |d 1962- | |
| 710 | 2 | |a ebrary, Inc. | |
| 856 | 4 | 0 | |u http://site.ebrary.com/lib/daystar/Doc?id=10494525 |z An electronic book accessible through the World Wide Web; click to view |
| 908 | |a 170314 | ||
| 942 | 0 | 0 | |c EB |
| 999 | |c 128021 |d 128021 | ||