Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
I tiakina i:
| Ngā kaituhi rangatōpū: | , |
|---|---|
| Hōputu: | Tāhiko īPukapuka |
| Reo: | Ingarihi |
| I whakaputaina: |
Washington, D.C. : Alexandria, VA :
National Academy Press ; Available from Defense Technical Information Center, Cameron Station,
1990.
|
| Ngā marau: | |
| Urunga tuihono: | An electronic book accessible through the World Wide Web; click to view |
| Ngā Tūtohu: |
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
|
Ngā tūemi rite: Materials for high-density electronic packaging and interconnection
- Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
- Microwave and millimeter-wave electronic packaging /
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- Portable consumer electronics packaging, materials, and reliability /
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