Citação APA (7ª ed.)
ebrary, Inc, Bailey, C., & Liu, J. (2006). Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging. Emerald Group Publishing.
Citação do estilo Chicago (17ª ed.)
ebrary, Inc, Christopher Bailey, e Johan Liu. Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Bradford, England: Emerald Group Publishing, 2006.
Citação MLA (9ª ed.)
ebrary, Inc, et al. Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Emerald Group Publishing, 2006.
Nota: a formatação da citação pode não corresponder 100% ao definido pela respectiva norma.