APA(7版)引用形式
ebrary, Inc, Bailey, C., & Liu, J. (2006). Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging. Emerald Group Publishing.
Chicagoスタイル(17版)引用形式
ebrary, Inc, Christopher Bailey, , Johan Liu. Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Bradford, England: Emerald Group Publishing, 2006.
MLA(9版)引用形式
ebrary, Inc, et al. Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Emerald Group Publishing, 2006.
警告: この引用は必ずしも正確ではありません.