Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging

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Bibliographic Details
Corporate Author:	ebrary, Inc
Other Authors:	Bailey, Christopher, Liu, Johan
Format:	Electronic eBook
Language:	English
Published:	Bradford, England : Emerald Group Publishing, c2006.
Series:	Soldering & surface mount technology ; v.18, no. 2
Subjects:	Manufacturing processes. Electronic packaging. Electronic books.
Online Access:	An electronic book accessible through the World Wide Web; click to view
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020			\|z 184663010X
035			\|a (CaPaEBR)ebr10132649
035			\|a (OCoLC)133162498
040			\|a CaPaEBR \|c CaPaEBR
050	1	4	\|a TK7870.15 \|b .A48 2006eb
245	0	0	\|a Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging \|h [electronic resource] / \|c guest editors Christopher Bailey and Johan Liu.
260			\|a Bradford, England : \|b Emerald Group Publishing, \|c c2006.
300			\|a 72 p.
490	0		\|a Soldering & surface mount technology ; \|v v.18, no. 2
533			\|a Electronic reproduction. \|b Palo Alto, Calif. : \|c ebrary, \|d 2009. \|n Available via World Wide Web. \|n Access may be limited to ebrary affiliated libraries.
650		0	\|a Manufacturing processes.
650		0	\|a Electronic packaging.
655		7	\|a Electronic books. \|2 local
700	1		\|a Bailey, Christopher.
700	1		\|a Liu, Johan.
710	2		\|a ebrary, Inc.
856	4	0	\|u http://site.ebrary.com/lib/daystar/Doc?id=10132649 \|z An electronic book accessible through the World Wide Web; click to view
908			\|a 170314
942	0	0	\|c EB
999			\|c 74051 \|d 74051