Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /

Documenti analoghi

• Microwave and millimeter-wave electronic packaging /
  di: Sturdivant, Rick
  Pubblicazione: (2014)
• ISTFA 2012 conference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA.
  Pubblicazione: (2012)
• Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
  di: Liu, S. (Sheng), 1963-
  Pubblicazione: (2011)
• Electronics, mechatronics and automation III : selected, peer reviewed papers from the 2014 3rd International Conference on Electronics, Mechatronics and Automation (ICEMA 2014), August 22-23, 2014, Dubai, UAE /
  Pubblicazione: (2014)
• Frontiers in electronics proceedings of the Workshop on Frontiers in Electronics 2009(WOFE) /
  Pubblicazione: (2009)