Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /
Furkejuvvon:
| Eará dahkkit: | |
|---|---|
| Materiálatiipa: | Elektrovnnalaš E-girji |
| Giella: | eaŋgalasgiella |
| Almmustuhtton: |
Zurich, Switzerland :
TTP,
2014.
|
| Ráidu: | Applied mechanics and materials ;
Volume 509. |
| Fáttát: | |
| Liŋkkat: | An electronic book accessible through the World Wide Web; click to view |
| Fáddágilkorat: |
Eai fáddágilkorat, Lasit vuosttaš fáddágilkora!
|
Geahča maid: Components, packaging and manufacturing technology II :
- Microwave and millimeter-wave electronic packaging /
- ISTFA 2012 conference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA.
- Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
- Electronics, mechatronics and automation III : selected, peer reviewed papers from the 2014 3rd International Conference on Electronics, Mechatronics and Automation (ICEMA 2014), August 22-23, 2014, Dubai, UAE /
- Frontiers in electronics proceedings of the Workshop on Frontiers in Electronics 2009(WOFE) /
- Knowledge-based intelligent information engineering systems and allied technologies KES 2002 /