Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
Gardado en:
| Autor Corporativo: | |
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| Outros autores: | , |
| Formato: | Electrónico eBook |
| Idioma: | inglés |
| Publicado: |
Bradford, England :
Emerald Group Publishing,
c2006.
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| Series: | Soldering & surface mount technology ;
v.18, no. 2 |
| Subjects: | |
| Acceso en liña: | An electronic book accessible through the World Wide Web; click to view |
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