Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
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| Korporativní autor: | |
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| Další autoři: | , |
| Médium: | Elektronický zdroj E-kniha |
| Jazyk: | angličtina |
| Vydáno: |
Bradford, England :
Emerald Group Publishing,
c2006.
|
| Edice: | Soldering & surface mount technology ;
v.18, no. 2 |
| Témata: | |
| On-line přístup: | An electronic book accessible through the World Wide Web; click to view |
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