Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
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| Ente Autore: | |
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| Altri autori: | , |
| Natura: | Elettronico eBook |
| Lingua: | inglese |
| Pubblicazione: |
Bradford, England :
Emerald Group Publishing,
c2006.
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| Serie: | Soldering & surface mount technology ;
v.18, no. 2 |
| Soggetti: | |
| Accesso online: | An electronic book accessible through the World Wide Web; click to view |
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