Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
שמור ב:
| מחבר תאגידי: | |
|---|---|
| מחברים אחרים: | , |
| פורמט: | אלקטרוני ספר אלקטרוני |
| שפה: | אנגלית |
| יצא לאור: |
Bradford, England :
Emerald Group Publishing,
c2006.
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| סדרה: | Soldering & surface mount technology ;
v.18, no. 2 |
| נושאים: | |
| גישה מקוונת: | An electronic book accessible through the World Wide Web; click to view |
| תגים: |
אין תגיות, היה/י הראשונ/ה לתייג את הרשומה!
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פריטים דומים: Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
- Lead-free solder interconnect reliability
- Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
- Microwave and millimeter-wave electronic packaging /
- Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
- Portable consumer electronics packaging, materials, and reliability /
- Adhesion in microelectronics /