APA (7th ed.) Citation
ebrary, Inc, Bailey, C., & Liu, J. (2006). Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging. Emerald Group Publishing.
Chicago Style (17th ed.) Citation
ebrary, Inc, Christopher Bailey, and Johan Liu. Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Bradford, England: Emerald Group Publishing, 2006.
MLA (9th ed.) Citation
ebrary, Inc, et al. Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Emerald Group Publishing, 2006.
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