APA (7th ed.) Zitazioa
ebrary, Inc, Bailey, C., & Liu, J. (2006). Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging. Emerald Group Publishing.
Chicago Style (17th ed.) Zitazioa
ebrary, Inc, Christopher Bailey, eta Johan Liu. Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Bradford, England: Emerald Group Publishing, 2006.
MLA (9th ed.) Zitazioa
ebrary, Inc, et al. Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Emerald Group Publishing, 2006.
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