ebrary, Inc, Bailey, C., & Liu, J. (2006). Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging. Emerald Group Publishing.
Successfully copied to clipboard
Copying to clipboard failed
Citación estilo Chicago
ebrary, Inc, Christopher Bailey, and Johan Liu. Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Bradford, England: Emerald Group Publishing, 2006.
Successfully copied to clipboard
Copying to clipboard failed
Cita MLA
ebrary, Inc, et al. Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Emerald Group Publishing, 2006.
Successfully copied to clipboard
Copying to clipboard failed
Warning: These citations may not always be 100% accurate.