Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging

Furkejuvvon:
Bibliográfalaš dieđut
Searvvušdahkki: ebrary, Inc
Eará dahkkit: Bailey, Christopher, Liu, Johan
Materiálatiipa: Elektrovnnalaš E-girji
Giella:eaŋgalasgiella
Almmustuhtton: Bradford, England : Emerald Group Publishing, c2006.
Ráidu:Soldering & surface mount technology ; v.18, no. 2
Fáttát:
Liŋkkat:An electronic book accessible through the World Wide Web; click to view
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