Lead-free solder interconnect reliability

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Bibliographic Details
Corporate Author:	ebrary, Inc
Other Authors:	Shangguan, Dongkai, 1963-
Format:	Electronic eBook
Language:	English
Published:	Materials Park, OH : ASM International, 2005.
Subjects:	Microelectronic packaging > Reliability. Solder and soldering. Lead-free electronics manufacturing processes. Electronic books.
Online Access:	An electronic book accessible through the World Wide Web; click to view
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