Lead-free solder interconnect reliability
שמור ב:
| מחבר תאגידי: | |
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| מחברים אחרים: | |
| פורמט: | אלקטרוני ספר אלקטרוני |
| שפה: | אנגלית |
| יצא לאור: |
Materials Park, OH :
ASM International,
2005.
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| נושאים: | |
| גישה מקוונת: | An electronic book accessible through the World Wide Web; click to view |
| תגים: |
אין תגיות, היה/י הראשונ/ה לתייג את הרשומה!
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פריטים דומים: Lead-free solder interconnect reliability
- Lead-free solders materials reliability for electronics /
- Microwave and millimeter-wave electronic packaging /
- Portable consumer electronics packaging, materials, and reliability /
- Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
- Adhesion in microelectronics /
- Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.