Tohutoro APA (7th ed.)
ebrary, Inc, & Shangguan, D. (2005). Lead-free solder interconnect reliability. ASM International.
Tohutoru Kātū Chicago (17th ed.)
ebrary, Inc, me Dongkai Shangguan. Lead-free Solder Interconnect Reliability. Materials Park, OH: ASM International, 2005.
Tohutoro MLA (9th ed.)
ebrary, Inc, me Dongkai Shangguan. Lead-free Solder Interconnect Reliability. ASM International, 2005.
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