Lead-free solder interconnect reliability

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Bibliographic Details
Corporate Author:	ebrary, Inc
Other Authors:	Shangguan, Dongkai, 1963-
Format:	Electronic eBook
Language:	English
Published:	Materials Park, OH : ASM International, 2005.
Subjects:	Microelectronic packaging > Reliability. Solder and soldering. Lead-free electronics manufacturing processes. Electronic books.
Online Access:	An electronic book accessible through the World Wide Web; click to view
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MARC


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007	cr cn\|\|\|\|\|\|\|\|\|
008	050525s2005 ohua sb 001 0 eng
010			\|z 2005050106
020			\|z 0871708167
035			\|a (CaPaEBR)ebr10320384
035			\|a (OCoLC)729262390
040			\|a CaPaEBR \|c CaPaEBR
050	1	4	\|a TK7870.15 \|b .L425 2005eb
082	0	4	\|a 621.381/046 \|2 22
245	0	0	\|a Lead-free solder interconnect reliability \|h [electronic resource] / \|c edited by Dongkai Shangguan.
260			\|a Materials Park, OH : \|b ASM International, \|c 2005.
300			\|a x, 292 p. : \|b ill.
504			\|a Includes bibliographical references and index.
533			\|a Electronic reproduction. \|b Palo Alto, Calif. : \|c ebrary, \|d 2013. \|n Available via World Wide Web. \|n Access may be limited to ebrary affiliated libraries.
650		0	\|a Microelectronic packaging \|x Reliability.
650		0	\|a Solder and soldering.
650		0	\|a Lead-free electronics manufacturing processes.
655		7	\|a Electronic books. \|2 local
700	1		\|a Shangguan, Dongkai, \|d 1963-
710	2		\|a ebrary, Inc.
856	4	0	\|u http://site.ebrary.com/lib/daystar/Doc?id=10320384 \|z An electronic book accessible through the World Wide Web; click to view
908			\|a 170314
942	0	0	\|c EB
999			\|c 101511 \|d 101511