Lead-free solder interconnect reliability

Lead-free solder interconnect reliability

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Bibliographic Details
Corporate Author: ebrary, Inc
Other Authors: Shangguan, Dongkai, 1963-
Format: Electronic eBook
Language:English
Published: Materials Park, OH : ASM International, 2005.
Subjects:
Microelectronic packaging > Reliability.
Solder and soldering.
Lead-free electronics manufacturing processes.
Electronic books.
Online Access:An electronic book accessible through the World Wide Web; click to view
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Description
Physical Description:x, 292 p. : ill.
Bibliography:Includes bibliographical references and index.

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