Adhesion in microelectronics /

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Bibliografski detalji
Daljnji autori:	Mittal, K. L., 1945- (Urednik), Ahsan, Tanweer (Urednik)
Format:	Elektronički e-knjiga
Jezik:	engleski
Izdano:	Hoboken, New Jersey ; Salem, Massachusetts : Scrivener Publishing : Wiley, 2014.
Serija:	Adhesion and adhesives. Fundamental and applied aspects.
Teme:	Microelectronic packaging > Materials. Adhesives. Adhesive joints. Electronic books.
Online pristup:	An electronic book accessible through the World Wide Web; click to view
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