Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.

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Detalhes bibliográficos
Corporate Authors:	National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging, ebrary, Inc
Formato:	Recurso Electrónico livro electrónico
Idioma:	inglês
Publicado em:	Washington, D.C. : Alexandria, VA : National Academy Press ; Available from Defense Technical Information Center, Cameron Station, 1990.
Assuntos:	Electronic packaging > Materials. Electrical engineering > Materials. Electronic books.
Acesso em linha:	An electronic book accessible through the World Wide Web; click to view
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