Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.

Enregistré dans:

Détails bibliographiques
Collectivités auteurs:	National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging, ebrary, Inc
Format:	Électronique eBook
Langue:	anglais
Publié:	Washington, D.C. : Alexandria, VA : National Academy Press ; Available from Defense Technical Information Center, Cameron Station, 1990.
Sujets:	Electronic packaging > Materials. Electrical engineering > Materials. Electronic books.
Accès en ligne:	An electronic book accessible through the World Wide Web; click to view
Tags:	Ajouter un tag Pas de tags, Soyez le premier à ajouter un tag!

Internet