Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
保存先:
| 共著者: | , |
|---|---|
| フォーマット: | 電子媒体 eBook |
| 言語: | 英語 |
| 出版事項: |
Washington, D.C. : Alexandria, VA :
National Academy Press ; Available from Defense Technical Information Center, Cameron Station,
1990.
|
| 主題: | |
| オンライン･アクセス: | An electronic book accessible through the World Wide Web; click to view |
| タグ: |
タグなし, このレコードへの初めてのタグを付けませんか!
|