Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
محفوظ في:
| مؤلفون مشاركون: | , |
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| التنسيق: | الكتروني كتاب الكتروني |
| اللغة: | الإنجليزية |
| منشور في: |
Washington, D.C. : Alexandria, VA :
National Academy Press ; Available from Defense Technical Information Center, Cameron Station,
1990.
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| الموضوعات: | |
| الوصول للمادة أونلاين: | An electronic book accessible through the World Wide Web; click to view |
| الوسوم: |
لا توجد وسوم, كن أول من يضع وسما على هذه التسجيلة!
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مواد مشابهة: Materials for high-density electronic packaging and interconnection
- Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
- Microwave and millimeter-wave electronic packaging /
- Microwave and millimeter-wave electronic packaging /
- Portable consumer electronics packaging, materials, and reliability /
- Portable consumer electronics packaging, materials, and reliability /
- Adhesion in microelectronics /