Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
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| Корпоративные авторы: | , |
|---|---|
| Формат: | Электронный ресурс eКнига |
| Язык: | английский |
| Опубликовано: |
Washington, D.C. : Alexandria, VA :
National Academy Press ; Available from Defense Technical Information Center, Cameron Station,
1990.
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| Предметы: | |
| Online-ссылка: | An electronic book accessible through the World Wide Web; click to view |
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