Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
Gorde:
| Egile nagusia: | |
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| Erakunde egilea: | |
| Beste egile batzuk: | |
| Formatua: | Baliabide elektronikoa eBook |
| Hizkuntza: | ingelesa |
| Argitaratua: |
Hoboken, N.J. :
Wiley,
2011.
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| Gaiak: | |
| Sarrera elektronikoa: | An electronic book accessible through the World Wide Web; click to view |
| Etiketak: |
Etiketarik gabe, Izan zaitez lehena erregistro honi etiketa jartzen!
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| Gaia: | "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- |
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| Deskribapen fisikoa: | xxii, 564 p. : ill. |
| Bibliografia: | Includes bibliographical references and index. |