Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
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| 格式: | 電子 電子書 |
| 語言: | 英语 |
| 出版: |
Hoboken, N.J. :
Wiley,
2011.
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| 主題: | |
| 在線閱讀: | An electronic book accessible through the World Wide Web; click to view |
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| 總結: | "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- |
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| 實物描述: | xxii, 564 p. : ill. |
| 參考書目: | Includes bibliographical references and index. |