Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
Gardado en:
| Autor Principal: | |
|---|---|
| Autor Corporativo: | |
| Outros autores: | |
| Formato: | Electrónico eBook |
| Idioma: | inglés |
| Publicado: |
Hoboken, N.J. :
Wiley,
2011.
|
| Subjects: | |
| Acceso en liña: | An electronic book accessible through the World Wide Web; click to view |
| Tags: |
Engadir etiqueta
Sen Etiquetas, Sexa o primeiro en etiquetar este rexistro!
|
| Summary: | "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- |
|---|---|
| Descrición Física: | xxii, 564 p. : ill. |
| Bibliografía: | Includes bibliographical references and index. |