Citazione Stile APA (7a Edizione)
Liu, S., & Liu, Y. (2011). Modeling and simulation for microelectronic packaging assembly: Manufacturing, reliability and testing. Wiley.
Citazione stile Chigago Style (17a edizione)
Liu, S., e Yong Liu. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing. Hoboken, N.J.: Wiley, 2011.
Citatione MLA (9a ed.)
Liu, S., e Yong Liu. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing. Wiley, 2011.
Attenzione: Queste citazioni potrebbero non essere precise al 100%.