Tohutoro APA (7th ed.)
Liu, S., & Liu, Y. (2011). Modeling and simulation for microelectronic packaging assembly: Manufacturing, reliability and testing. Wiley.
Tohutoru Kātū Chicago (17th ed.)
Liu, S., me Yong Liu. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing. Hoboken, N.J.: Wiley, 2011.
Tohutoro MLA (9th ed.)
Liu, S., me Yong Liu. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing. Wiley, 2011.
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