Liu, S., & Liu, Y. (2011). Modeling and simulation for microelectronic packaging assembly: Manufacturing, reliability and testing. Wiley.
Чикаго-гийн эшлэл (17 дахь хэвлэлт)Liu, S., ба Yong Liu. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing. Hoboken, N.J.: Wiley, 2011.
MLA -ийн эшлэл (9 дэх хэвлэлт)Liu, S., ба Yong Liu. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing. Wiley, 2011.
Анхааруулга: Эдгээр ишлэлүүд үргэлж 100% үнэн зөв биш байж магадгүй.