Cita APA (7th ed.)

Liu, S., & Liu, Y. (2011). Modeling and simulation for microelectronic packaging assembly: Manufacturing, reliability and testing. Wiley.

Cita Chicago (17th ed.)

Liu, S., i Yong Liu. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing. Hoboken, N.J.: Wiley, 2011.

Cita MLA (9th ed.)

Liu, S., i Yong Liu. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing. Wiley, 2011.