Liu, S., & Liu, Y. (2011). Modeling and simulation for microelectronic packaging assembly: Manufacturing, reliability and testing. Wiley.
芝加哥风格引文Liu, S., 与 Yong Liu. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing. Hoboken, N.J.: Wiley, 2011.
MLA引文Liu, S., 与 Yong Liu. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing. Wiley, 2011.
警告：这些引文格式不一定是100％准确.