Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
-д хадгалсан:
| Үндсэн зохиолч: | |
|---|---|
| Байгууллагын зохиогч: | |
| Бусад зохиолчид: | |
| Формат: | Цахим Цахим ном |
| Хэл сонгох: | англи |
| Хэвлэсэн: |
Hoboken, N.J. :
Wiley,
2011.
|
| Нөхцлүүд: | |
| Онлайн хандалт: | An electronic book accessible through the World Wide Web; click to view |
| Шошгууд: |
Шошго нэмэх
Шошго байхгүй, Энэхүү баримтыг шошголох эхний хүн болох!
|
| Тойм: | "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- |
|---|---|
| Биет тодорхойлолт: | xxii, 564 p. : ill. |
| Номзүй: | Includes bibliographical references and index. |