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Handbook of 3D integration. Volume 3, 3D process technology /

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Wedi'i Gadw mewn:
Awduron Eraill: Garrou, Philip (Golygydd), Koyanagi, Mitsumasa (Golygydd), Ramm, Peter (Golygydd), Allen, Ricky (Cyfrannwr)
Fformat: Electronig eLyfr
Iaith:Saesneg
Cyhoeddwyd: Weinheim, Germany : Wiley-VCH, 2014.
Pynciau:
Integrated circuits.
Integrated circuits > Design and construction.
Silicon.
Three-dimensional imaging.
Electronic books.
Mynediad Ar-lein:An electronic book accessible through the World Wide Web; click to view
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