Adhesion in microelectronics /
Furkejuvvon:
| Eará dahkkit: | , |
|---|---|
| Materiálatiipa: | Elektrovnnalaš E-girji |
| Giella: | eaŋgalasgiella |
| Almmustuhtton: |
Hoboken, New Jersey ; Salem, Massachusetts :
Scrivener Publishing : Wiley,
2014.
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| Ráidu: | Adhesion and adhesives. Fundamental and applied aspects.
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| Fáttát: | |
| Liŋkkat: | An electronic book accessible through the World Wide Web; click to view |
| Fáddágilkorat: |
Eai fáddágilkorat, Lasit vuosttaš fáddágilkora!
|
Geahča maid: Adhesion in microelectronics /
- Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
- Microwave and millimeter-wave electronic packaging /
- Portable consumer electronics packaging, materials, and reliability /
- Lead-free solder interconnect reliability
- Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
- Boundary-scan interconnect diagnosis