Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.

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Bibliographic Details
Corporate Authors:	National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging, ebrary, Inc
Format:	Electronic eBook
Language:	English
Published:	Washington, D.C. : Alexandria, VA : National Academy Press ; Available from Defense Technical Information Center, Cameron Station, 1990.
Subjects:	Electronic packaging > Materials. Electrical engineering > Materials. Electronic books.
Online Access:	An electronic book accessible through the World Wide Web; click to view
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Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, C...

Published 1990

An electronic book accessible through the World Wide Web; click to view

Electronic eBook