11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /
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| Format: | Electronic Conference Proceeding eBook |
| Language: | English |
| Published: |
Pfaffikon, Switzerland :
TTP,
2014.
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| Series: | Advanced materials research ;
Volume 1038. |
| Subjects: | |
| Online Access: | An electronic book accessible through the World Wide Web; click to view |
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