11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /
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| Autor Corporativo: | |
|---|---|
| Outros Autores: | |
| Formato: | Recurso Eletrônico Anais de Congresso livro eletrônico |
| Idioma: | inglês |
| Publicado em: |
Pfaffikon, Switzerland :
TTP,
2014.
|
| coleção: | Advanced materials research ;
Volume 1038. |
| Assuntos: | |
| Acesso em linha: | An electronic book accessible through the World Wide Web; click to view |
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