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11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /

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Sábháilte in:
Údar corparáideach: International Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany
Rannpháirtithe: Franke, Jörg (Eagarthóir)
Formáid: Leictreonach Imeacht comhdhála Ríomhleabhar
Teanga:Béarla
Foilsithe / Cruthaithe: Pfaffikon, Switzerland : TTP, 2014.
Sraith:Advanced materials research ; Volume 1038.
Ábhair:
Molded interconnect devices.
Three-dimensional display systems > Congresses.
Electronic books.
Rochtain ar líne:An electronic book accessible through the World Wide Web; click to view
Clibeanna: Cuir clib leis
Níl clibeanna ann, Bí ar an gcéad duine le clib a chur leis an taifead seo!
Cur síos fisiciúil:1 online resource (119 pages) : illustrations.
Leabharliosta:Includes bibliographical references at the end of each chapters and index.
ISBN:9783038266365 (e-book)
ISSN:1662-8985 ;
1662-8985

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