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11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /

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Autor kompanije: International Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany
Daljnji autori: Franke, Jörg (Urednik)
Format: Elektronički Izvještaj sastanka e-knjiga
Jezik:engleski
Izdano: Pfaffikon, Switzerland : TTP, 2014.
Serija:Advanced materials research ; Volume 1038.
Teme:
Molded interconnect devices.
Three-dimensional display systems > Congresses.
Electronic books.
Online pristup:An electronic book accessible through the World Wide Web; click to view
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Opis fizičkog objekta:1 online resource (119 pages) : illustrations.
Bibliografija:Includes bibliographical references at the end of each chapters and index.
ISBN:9783038266365 (e-book)
ISSN:1662-8985 ;
1662-8985

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