11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /

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Bibliographic Details
Corporate Author: International Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany
Other Authors: Franke, Jörg (Editor)
Format: Electronic Conference Proceeding eBook
Language:English
Published: Pfaffikon, Switzerland : TTP, 2014.
Series:Advanced materials research ; Volume 1038.
Subjects:
Online Access:An electronic book accessible through the World Wide Web; click to view
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111 2 |a International Congress Molded Interconnect Devices  |n (11th :  |d 2014 :  |c Nuremberg / Fuerth, Germany) 
245 1 0 |a 11th international congress molded interconnect devices :  |b scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /  |c edited by Jörg Franke [and three others]. 
264 1 |a Pfaffikon, Switzerland :  |b TTP,  |c 2014. 
264 2 |a Enfield, New Hampshire :  |b Trans Tech Publications Ltd,  |c [date of distribution not identified] 
264 4 |c ©2014 
300 |a 1 online resource (119 pages) :  |b illustrations. 
336 |a text  |2 rdacontent 
337 |a computer  |2 rdamedia 
338 |a online resource  |2 rdacarrier 
490 1 |a Advanced Materials Research,  |x 1662-8985 ;  |v Volume 1038 
504 |a Includes bibliographical references at the end of each chapters and index. 
588 |a Description based on online resource; title from PDF title page (ebrary, viewed October 16, 2014). 
590 |a Electronic reproduction. Palo Alto, Calif. : ebrary, 2014. Available via World Wide Web. Access may be limited to ebrary affiliated libraries. 
650 0 |a Molded interconnect devices. 
650 0 |a Three-dimensional display systems  |v Congresses. 
655 0 |a Electronic books. 
700 1 |a Franke, Jörg,  |e editor. 
776 0 8 |i Print version:  |a International Congress Molded Interconnect Devices (11th : 2014 : Nuremberg / Fuerth, Germany)  |t 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany.  |d Pfaffikon, Switzerland : TTP, c2014  |h 124 pages  |k Advanced materials research ; Volume 1038.  |x 1662-8985  |z 9783038352525 
797 2 |a ebrary. 
830 0 |a Advanced materials research ;  |v Volume 1038. 
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