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ISTFA 2003 proceedings of the 29th International Symposium for Testing and Failure Analysis, 2-6 November 2003, Santa Clara Convention Center, Santa Clara, California /

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Gardado en:
Corporate Authors: International Symposium for Testing and Failure Analysis Santa Clara, Calif., ASM International, Electronic Device Failure Analysis Society, ebrary, Inc
Formato: Electrónico Conference Proceeding eBook
Idioma:inglés
Publicado: Materials Park, Ohio : ASM International, 2003.
Subjects:
Electronics > Materials > Testing > Congresses.
Electronic apparatus and appliances > Testing > Congresses.
Electronic books.
Acceso en liña:An electronic book accessible through the World Wide Web; click to view
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Descrición Física:518 p. : ill.
Bibliografía:Includes bibliographical references and index.

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