Lead-free solder interconnect reliability
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| Corporate Author: | |
|---|---|
| Other Authors: | |
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Materials Park, OH :
ASM International,
2005.
|
| Subjects: | |
| Online Access: | An electronic book accessible through the World Wide Web; click to view |
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| 005 | 20171002055923.0 | ||
| 006 | m u | ||
| 007 | cr cn||||||||| | ||
| 008 | 050525s2005 ohua sb 001 0 eng | ||
| 010 | |z 2005050106 | ||
| 020 | |z 0871708167 | ||
| 035 | |a (CaPaEBR)ebr10320384 | ||
| 035 | |a (OCoLC)729262390 | ||
| 040 | |a CaPaEBR |c CaPaEBR | ||
| 050 | 1 | 4 | |a TK7870.15 |b .L425 2005eb |
| 082 | 0 | 4 | |a 621.381/046 |2 22 |
| 245 | 0 | 0 | |a Lead-free solder interconnect reliability |h [electronic resource] / |c edited by Dongkai Shangguan. |
| 260 | |a Materials Park, OH : |b ASM International, |c 2005. | ||
| 300 | |a x, 292 p. : |b ill. | ||
| 504 | |a Includes bibliographical references and index. | ||
| 533 | |a Electronic reproduction. |b Palo Alto, Calif. : |c ebrary, |d 2013. |n Available via World Wide Web. |n Access may be limited to ebrary affiliated libraries. | ||
| 650 | 0 | |a Microelectronic packaging |x Reliability. | |
| 650 | 0 | |a Solder and soldering. | |
| 650 | 0 | |a Lead-free electronics manufacturing processes. | |
| 655 | 7 | |a Electronic books. |2 local | |
| 700 | 1 | |a Shangguan, Dongkai, |d 1963- | |
| 710 | 2 | |a ebrary, Inc. | |
| 856 | 4 | 0 | |u http://site.ebrary.com/lib/daystar/Doc?id=10320384 |z An electronic book accessible through the World Wide Web; click to view |
| 908 | |a 170314 | ||
| 942 | 0 | 0 | |c EB |
| 999 | |c 101511 |d 101511 | ||