Lead-free solder interconnect reliability
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| Corporate Author: | |
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| Format: | Electronic eBook |
| Language: | English |
| Published: |
Materials Park, OH :
ASM International,
2005.
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| Subjects: | |
| Online Access: | An electronic book accessible through the World Wide Web; click to view |
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| Physical Description: | x, 292 p. : ill. |
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| Bibliography: | Includes bibliographical references and index. |