Cita APA (7a ed.)
ebrary, Inc, & Shangguan, D. (2005). Lead-free solder interconnect reliability. ASM International.
Cita Chicago Style (17a ed.)
ebrary, Inc, y Dongkai Shangguan. Lead-free Solder Interconnect Reliability. Materials Park, OH: ASM International, 2005.
Cita MLA (9a ed.)
ebrary, Inc, y Dongkai Shangguan. Lead-free Solder Interconnect Reliability. ASM International, 2005.
Precaución: Estas citas no son 100% exactas.