Design and modeling for 3D ICs and interposers /

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Bibliographic Details
Main Author:	Swaminathan, Madhavan
Other Authors:	Han, Ki Jin
Format:	Electronic eBook
Language:	English
Published:	Singapore ; Hackensack, New Jersey : World Scientific Publishing Company, [2014]
Series:	WSPC series in advanced integration and packaging ; v. 2.
Subjects:	Integrators. Systems integration. Electronic books.
Online Access:	An electronic book accessible through the World Wide Web; click to view
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020			\|a 9789814508605 (ebook)
020			\|z 9789814508599
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035			\|a (OCoLC)868921436
040			\|a CaPaEBR \|b eng \|e rda \|e pn \|c CaPaEBR
050	1	4	\|a TA168 \|b .S93 2014eb
100	1		\|a Swaminathan, Madhavan.
245	1	0	\|a Design and modeling for 3D ICs and interposers / \|c Madhavan Swaminathan, Ki Jin Han.
264		1	\|a Singapore ; \|a Hackensack, New Jersey : \|b World Scientific Publishing Company, \|c [2014]
264		4	\|c ©2014
300			\|a 1 online resource (379 pages) : \|b illustrations
336			\|a text \|2 rdacontent
337			\|a computer \|2 rdamedia
338			\|a online resource \|2 rdacarrier
490	1		\|a WSPC series in advanced integration and packaging ; \|v volume 2
504			\|a Includes bibliographical references and index.
588			\|a Description based on online resource; title from PDF (ebrary, viewed December 30, 2013).
590			\|a Electronic reproduction. Palo Alto, Calif. : ebrary, 2014. Available via World Wide Web. Access may be limited to ebrary affiliated libraries.
650		0	\|a Integrators.
650		0	\|a Systems integration.
655		0	\|a Electronic books.
700	1		\|a Han, Ki Jin.
797	2		\|a ebrary.
830		0	\|a WSPC series in advanced integration and packaging ; \|v v. 2.
856	4	0	\|u http://site.ebrary.com/lib/daystar/Doc?id=10813527 \|z An electronic book accessible through the World Wide Web; click to view
908			\|a 170314
942	0	0	\|c EB
999			\|c 166831 \|d 166831