Design and modeling for 3D ICs and interposers /

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Bibliographic Details
Main Author:	Swaminathan, Madhavan
Other Authors:	Han, Ki Jin
Format:	Electronic eBook
Language:	English
Published:	Singapore ; Hackensack, New Jersey : World Scientific Publishing Company, [2014]
Series:	WSPC series in advanced integration and packaging ; v. 2.
Subjects:	Integrators. Systems integration. Electronic books.
Online Access:	An electronic book accessible through the World Wide Web; click to view
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