Design and modeling for 3D ICs and interposers /
I tiakina i:
| Kaituhi matua: | |
|---|---|
| Ētahi atu kaituhi: | |
| Hōputu: | Tāhiko īPukapuka |
| Reo: | Ingarihi |
| I whakaputaina: |
Singapore ; Hackensack, New Jersey :
World Scientific Publishing Company,
[2014]
|
| Rangatū: | WSPC series in advanced integration and packaging ;
v. 2. |
| Ngā marau: | |
| Urunga tuihono: | An electronic book accessible through the World Wide Web; click to view |
| Ngā Tūtohu: |
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
|