Design and modeling for 3D ICs and interposers /
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| Hovedforfatter: | |
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| Andre forfattere: | |
| Format: | Electronisk eBog |
| Sprog: | engelsk |
| Udgivet: |
Singapore ; Hackensack, New Jersey :
World Scientific Publishing Company,
[2014]
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| Serier: | WSPC series in advanced integration and packaging ;
v. 2. |
| Fag: | |
| Online adgang: | An electronic book accessible through the World Wide Web; click to view |
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