Design and modeling for 3D ICs and interposers /
Wedi'i Gadw mewn:
| Prif Awdur: | |
|---|---|
| Awduron Eraill: | |
| Fformat: | Electronig eLyfr |
| Iaith: | Saesneg |
| Cyhoeddwyd: |
Singapore ; Hackensack, New Jersey :
World Scientific Publishing Company,
[2014]
|
| Cyfres: | WSPC series in advanced integration and packaging ;
v. 2. |
| Pynciau: | |
| Mynediad Ar-lein: | An electronic book accessible through the World Wide Web; click to view |
| Tagiau: |
Dim Tagiau, Byddwch y cyntaf i dagio'r cofnod hwn!
|